LWAIPT6000 is automatically controlled by PC program, and operated boy large LCD. Multigroup servo system matching with sensor automatically conveys card and IC module to seal. Parameters are adjustable, speed is fast and precision is high.
It is adapable for implantingand procesing of IC mould on card whose slot is milled.
1、It incorporates conveying of card, glue laminating of IC , punching and conveying, hot welding and cold welding seaing, test of IC mould.
2、Sending card by belt structure, which speed is fast and conveying is stable.
3、Proper card amending structure ensures high implantingprecision.
4、Using servo dynamo system stepping conveys IC module punching, which parameters are adjustable, punching precision is high, adjustmemt is more convenient.
5、Using servo dynamo drives imported high precision linear module structure conveying IC module, which precision is high, working longevity is longer.
6、First hot weld it, then cold weld it . Implantingtemperature is adjustable, effect is good.
7、Special hot welding implantingrecycle cooling system, which is adaptable to implantingof different specifications.
8、Module position automatically amends and positions, whose precision is high.
9、Module stepping eletric eye automatically monitor and protects the quality of module, and automatically clear the bad one away.
10、PC program controls automatic running, operating rate is fast. If there are any error, machine will alert and stop.
11、Our self-developed PC computer embedding IC module reading test system is widely used and powerful.
|Power supply||AC 220V 50/60 HZ||Control method||PC program control+servo system|
|Total power||2.5 KW||operator||1 person|
|Air source||6kg/cm2(no water)||Temperature control range||0~400℃(can be set)|
|Air consumption||Approx 80L/min||Implantingwork station||Four hot and one cold|
|Weight||Approx 700Kg||Card spec.||ISO CR80/IEC7810|
|Output||3500~4500 pcs/h||Overall dimension||L1750xW850xH1750 mm|